جهت دسترسی به کاربرگه ی زیر، از این لینک استفاده کنید. http://dl.pgu.ac.ir/handle/Hannan/81327
Title: The Influence of Cu on Metastable NiSn4 in Sn-3.5Ag-xCu/ENIG Joints
Keywords: Science & Technology;Technology;Physical Sciences;Engineering, Electrical & Electronic;Materials Science, Multidisciplinary;Physics, Applied;Engineering;Materials Science;Physics;Microstructure;Pb-free soldering;metastable;NiSn4;intermetallics;solidification;INTERMETALLIC COMPOUND GROWTH;SN/NI INTERFACIAL REACTIONS;LEAD-FREE SOLDERS;NI-SN;ELECTROPLATED-NI;TEMPERATURE;SUBSTRATE;KINETICS;SN-3.5AG;MICROSTRUCTURE;Science & Technology;Technology;Physical Sciences;Engineering, Electrical & Electronic;Materials Science, Multidisciplinary;Physics, Applied;Engineering;Materials Science;Physics;Microstructure;Pb-free soldering;metastable;NiSn4;intermetallics;solidification;INTERMETALLIC COMPOUND GROWTH;SN/NI INTERFACIAL REACTIONS;LEAD-FREE SOLDERS;NI-SN;ELECTROPLATED-NI;TEMPERATURE;SUBSTRATE;KINETICS;SN-3.5AG;MICROSTRUCTURE;Applied Physics; Electrical And Electronic Engineering
Issue Date: 28-Nov-2016
20-Aug-2015
25-Jul-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
place: Engineering & Physical Science Research Council (EPSRC)
Description: We have investigated the effect of small amounts of Cu on suppression of metastable bSn-NiSn4 eutectic growth in solder joints between Sn-3.5Ag-xCu solders and Ni-based substrates. For Sn-3.5Ag/electroless nickel immersion gold (ENIG) and Sn-3.5Ag/Ni solder joints we showed that the eutectic mixture contains bSn, Ag3Sn, and metastable NiSn4. It was found that addition of only 0.005 wt.% Cu to Sn-3.5Ag-xCu/ENIG or Sn-3.5Ag-xCu/Ni joints promoted formation of a stable bSn-Ni3Sn4 eutectic and that both Ni3Sn4 and NiSn4 occur in the eutectic at this Cu level. We also showed that for complete prevention of formation of metastable NiSn4 during eutectic solidification of the solder joint, addition of at least 0.3 wt.% Cu was required.
Other Identifiers: 1543-186X
http://hdl.handle.net/10044/1/42748
https://dx.doi.org/10.1007/s11664-015-3964-5
N/A
EP/M002241/1
Type Of Material: Other
Appears in Collections:Faculty of Engineering

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